It offers 18% higher logic density than TSMC’s 7nm (N7) process and is compatible with the 7nm design, which is said to reduce the time to market for consumer products.
TSMC’s 6nm process node was already introduced last year in the company’s current roadmap, is code-named “N6” and will use an advanced version of EUV lithography technology. TSMC to take Intel's GPU foundry order next year with 6nm process Taiwan-based sources also claim that Intel is likely to use TSMC’s 6nm process node for its gaming GPUs, which will then compete with AMD’s RDNA 2 and NVIDIA’s amp CPUs when they hit the shelves in stores. Reports from Taiwanese circles seem to indicate that TSMC is very confident of winning the orders for Intel’s Xe-HPG GPUs.Īs reported by IThome (via Intel’s Xe-HPG GPUs will be manufactured in TSMC’s factories using its advanced manufacturing technologies. Unlike the Xe-LP and Xe-HP GPUs, which are manufactured in the company’s own 10nm SuperFin process, the Xe-HPG GPUs are to be produced in an external foundry, with TSMC being the most likely and promising candidate. Intel will probably launch its first discrete gaming graphics cards based on next-generation Xe HPG GPUs as early as next year.
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